This source category includes, but is not limited to, facilities that manufacture semiconductors (including light-emitting diodes), micro-electromechanical systems (MEMS), liquid crystal displays (LCDs), and photovoltaic cells (PV). Specifically, this subsector consists of electronics manufacturing facilities with production processes that use plasma-generated fluorine atoms and other reactive fluorine-containing fragments to etch thin films, clean chambers for depositing thin films, clean wafers, or remove residual material. The source category also includes electronics manufacturing facilities with chemical vapor deposition processes or other production processes that use N2O, and with processes that use fluorinated GHGs as heat transfer fluids (HTF) to control temperature or clean surfaces.

• Location and emissions range for each reporting facility in the subsector (as of 9/1/13).

  

  This map shows the locations of direct-emitting facilities. The size of a circle corresponds to the quantity of emissions reported by that facility.

Totals may not equal sum of individual GHGs due to independent rounding.
** Total reported emissions are less than 0.05 million metric tons CO2e.

CO2 emissions from the combustion of biomass are NOT included in the emissions totals provided above.