Electrical and Electronic Components Effluent Guidelines
EPA promulgated the Electrical and Electronic Components (E&EC) Effluent Guidelines and Standards (40 CFR Part 469) in 1983. The regulation covers direct
direct dischargerA point source that discharges pollutants to waters of the United States, such as streams, lakes, or oceans. and indirectindirect dischargerA facility that discharges pollutants to a publicly owned treatment works (municipal sewage treatment plant). dischagers. The E&EC Effluent Guidelines and Standards are incorporated into NPDES permits for direct dischargers, and permits or other control mechanisms for indirect dischargers (see Pretreatment Program).
What is the Electrical and Electronic Components Industry?
E&EC facilities manufacture semiconductors, such as integrated circuits and light emitting diodes (LEDs); electronic crystals (made from quartz, ceramics and other materials), cathode ray tubes; and luminescent materials used as coatings in fluorescent lamps.
Wastewater is generated from processes such as etching, cleaning, degreasing, cutting and grinding. Pollutants found in wastewaters include fluoride, arsenic and organic compounds.
| Processes | Description |
|---|---|
| Cutting and slicing | Crystals are cut or sliced using diamond blade saws or slurry saws. Water can be used for cooling and lubrication and to carry away removed material. |
| Lapping or polishing | Mechanical grinders and chemical etchants are used to remove surface oxides and to provide a smooth surface. Water can be used for cooling and lubrication and to carry away removed material. |
| Cleaning, rinsing and degreasing | Removal of etchants, photoresist material, stripping solutions and acid and alkaline solutions from materials after various processing and production steps. |
- 325180: Other Basic Inorganic Chemical Manufacturing
- 334413: Semiconductor and Related Device Manufacturing
- 334418: Printed Circuit Assembly (Electronic Assembly) Manufacturing
- 334419: Other Electronic Component Manufacturing
Note: the NAICS listing is provided as a guide and does not define the coverage of the E&EC category. For precise definitions of coverage, see the applicability sections in 40 CFR Part 469.
Facilities Covered
- Semiconductor
- Electronic Crystals
- Cathode Ray Tube
- Luminescent Materials
Guidance Documents
- Permitting Guidance for Semiconductor Manufacturing Facilities (Memo, 4/21/1998)
Clarification on the scope of the E&EC Category and the Metal Finishing Category (40 CFR Part 433) applicable to semiconductor manufacturing facilities - Guidance Manual for Implementing Total Toxic Organics (TTO) Pretreatment Standards (1985)
Rulemaking History
1983 “Phase 2” Rule
- Documents, including:
- Final Rule: 48 FR 55690, 12/14/1983
- Development Document
Industry description, wastewater characterization, treatment technologies, regulatory compliance cost estimates and pollutant loadings for the final rule - Proposed Rule: 48 FR 10012, 3/9/1983
1983 “Phase 1” Rule
- Documents, including:
- Final Rule: 48 FR 15382, 4/8/1983
- Development Document
Industry description, wastewater characterization, treatment technologies, regulatory compliance cost estimates and pollutant loadings for the final rule - Proposed Rule: 47 FR 37048, 8/24/1982
Additional Information
For additional information regarding E&EC Effluent Guidelines, please contact Jesse Pritts (pritts.jesse@epa.gov) or 202-566-1038.