- Semiconductor Manufacturing Guidance (1998)
- 1983 "Phase 2" Rule: Subparts C & D
- 1983 "Phase 1" Rule: Subparts A & B
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Permitting Guidance for Semiconductor Manufacturing Facilities (Memo) (PDF)(15 pp, 721 K,
April 21, 1998)
Clarification on the scope of the Electrical and Electronic Components Category (40 CFR Part 469), and the Metal Finishing Category (40 CFR Part 433) applicable to semiconductor manufacturing facilities
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Guidance Manual for Implementing Total Toxic Organics (TTO) Pretreatment Standards (PDF)(86 pp, 4 MB,
September 1985)
Applicable to the Electroplating, Metal Finishing, Electrical and Electronic Components, Copper Forming, Aluminum Forming and Coil Coating Categories
- Electrical and Electronic Components Effluent Guidelines - Final Rule (Phase 2) (PDF)(16 pp, 2 MB, December 14, 1983, 48 FR 55690)
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Development Document for Effluent Limitations Guidelines for the Electrical and Electronic Components Point Source Category, Phase 2 (PDF)(175 pp, 6 MB,
February 1984,
440/1-84/075)
Industry description, wastewater characterization, treatment technologies, regulatory compliance cost estimates and pollutant loadings for the final rule
- Electrical and Electronic Components Effluent Guidelines - Proposed Rule (Phase 2) (PDF)(11 pp, 1 MB, March 9, 1983, 48 FR 10012)
- Electrical and Electronic Components Effluent Guidelines - Final Rule (Phase 1) (PDF)(15 pp, 2 MB, April 8, 1983, 48 FR 15382)
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Development Document for Effluent Limitations Guidelines for the Electrical and Electronic Components Point Source Category, Phase 1 (PDF)(220 pp, 8 MB,
April 1983,
440/1-83/075)
Industry description, wastewater characterization, treatment technologies, regulatory compliance cost estimates and pollutant loadings for the final rule
- Electrical and Electronic Components Effluent Guidelines - Proposed Rule (Phase 1) (PDF)(13 pp, 2 MB, August 24, 1982, 47 FR 37048)